Package Bonding Details Assembly Test Vehicle An Assembly Test Vehicle (ATV ) was developed that had the same ... This was a dual use package which evaluated both wire bond reliability and package to Printed Wiring Board (PWB)anbsp;...
|Title||:||Proceedings of the ... International Conference on Multichop Modules|
|Author||:||Semiconductor Equipment and Materials International, International Electronics Packing Society, Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)|
|Publisher||:||Ishm - 1994|