This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.Preparation of Packaged Samples for Reliability Testing The laser diode array packages investigated are continuous wave (CW) laser diode bars. A schematic diagram of a packaged bar is shown in Figures 13.6(a) and (b). The GaAs multipleanbsp;...
|Title||:||Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging|
|Author||:||Ephraim Suhir, Y.C. Lee, C.P. Wong|
|Publisher||:||Springer Science & Business Media - 2007-05-26|