ISTFA 2014

ISTFA 2014

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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.... phone; +606-2873715, fax: +606-2325069 Nitric Acid (HNO3) 100% Tweezer Hot Plate DUT assembly CuP ... Smart phones and tablets comprise two of the fastest moving, highest volume, and most competitive markets in the world with form, fit and function evolving at an unprecedented rate ... application processors, power management, baseband and ASICs where some combination of ROHS/ Greenanbsp;...

Title:ISTFA 2014
Publisher:ASM International - 2014-11-01


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