Gold is a common metal chosen for MEMS electrical contacts because of its high conductivity, ductility, inertness, and low resistivity, contact resistance and susceptibility to oxidation. However, due to the low hardness of gold, adhesion failure is prone in cycling conditions which reduces the reliability of the contacts. R.A. Coutu, P.E. Kladitis, K.D. Leedy, and R.L. Crane. Selecting metal alloy electric ... The partial constitutional diagram TiAu2-Au: lattice parameters of the Alpha solid solutions and the intermediate phase TiAu4. Journal of the Institute of anbsp;...
|Title||:||Investigation of the Near Surface Mechanical Properties of Gold-titanium Thin Films|
|Author||:||Golnaz Bassiri Jahromi|
|Publisher||:||ProQuest - 2008|