Hybrid Microcircuit Technology Handbook, 2nd Edition

Hybrid Microcircuit Technology Handbook, 2nd Edition

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The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.... is the ability to fabricate net shape products obviating the need to perform expensive machining and loss of material. ... 5.6 Rework and Repair Reworking high density multichip modules is more difficult than reworking hybrid microcircuits, anbsp;...

Title:Hybrid Microcircuit Technology Handbook, 2nd Edition
Author:James J. Licari, Leonard R. Enlow
Publisher:William Andrew - 2008-12-11


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