Handbook of 3D Integration

Handbook of 3D Integration

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.They did not announce process details or whether it will be used on their flash or DRAM product lines or both. 2.4.2 Volatile Memory Technology: SRAM and DRAM 3D technologies developed by Samsung, Micron, NEC and Tezzaron are allanbsp;...

Title:Handbook of 3D Integration
Author:Philip Garrou, Christopher Bower, Peter Ramm
Publisher:John Wiley & Sons - 2011-09-22


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