Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos... and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections, aquot; Journal of Electronic Packaging, Transactions of the ASME, Vol. 115, No. 2, June 1993, pp. 173-179.  Weinbel, R. C, Tien, J. K., Pollak, anbsp;...
|Title||:||Fatigue of Electronic Materials|
|Author||:||Scott A. Schroeder, Michael R. Mitchell|
|Publisher||:||ASTM International - 1994-01-01|