With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.Both the product and electronics package subelements should be designed for ease of production processes, and should ... This design specification affects placement, reflow soldering, visual inspection, test and repair of PCB assembly.
|Title||:||Failure Modes and Mechanisms in Electronic Packages|
|Author||:||P. Singh, Puligandla Viswanadham|
|Publisher||:||Springer Science & Business Media - 2012-12-06|