This is an authoritative reference source of practical information on the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgment of 407 expert microelectronics packaging authors, co-authors, and reviewers. This multi-author approach ensures the best, most timely information throughout. Panels of experts reviewed each article for technical accuracy, generic point of view, and completeness. A glossary of terms and definitions common to this field will be a much used reference source. Book jacket.A typical manufacturing and test flow sequence for Si-Si hybrids is given below: 1 . ... Failures identified at the final system test level are traditionally the most expensive to locate and repair, and such failures become even more expensive foranbsp;...
|Title||:||Electronic Materials Handbook|
|Publisher||:||ASM International - 1989-11-01|