Dielectrics for Nanosystems

Dielectrics for Nanosystems

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Compared with the fabricated high-density 3-D packaging module and conventional CCD imaging data transmission circuit board, the 3-D packaging module realizes far higher packaging density than the conventional board Fig. 15 showsanbsp;...

Title:Dielectrics for Nanosystems
Publisher:The Electrochemical Society - 2004


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