Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.Solderability of Integrated Circuits JAMES A. KARGOL, ANTHONY M. PETRUCCI , and TIMOTHY M. McGUIG GAN Contents 7.1 Introduction 7.2 Electronic Soldering Basics 7.3 IC Package Designs, Materials, and Solderability Test Methodsanbsp;...
|Title||:||Characterization of Integrated Circuit Packaging Materials|
|Publisher||:||Elsevier - 2013-10-22|