The physical contact between these two components required the separate manual die bonding operation. Average time for this ... The laser die was bonded to the evaporated indium surface on the copper heatsink after the die had been aligned. A Hughes HVT-100 ... The same type of special reticle aforementioned was used in the alignment microscope. The reticle pattern ... Heatsink Fabrication The heatsink was manufactured from CDA #110 copper material. As an intermediateanbsp;...
|Author||:||Jack D. Lane|
|Publisher||:||Society of Manufacturing Engineers - 1986-01-01|