Advances in Electronic Packaging

Advances in Electronic Packaging

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air flow I/O pin Qp Qi (heat loss) Fig. ... This coupling between QA and QB is brought by air mass warmed up by QA, then, blanketing the floor area around the ... The ceramic heater has a thick-film resistor and a pair of 2 mm dia. lead pins.

Title:Advances in Electronic Packaging
Publisher: - 1999


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