3D Integration for VLSI Systems

3D Integration for VLSI Systems

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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.The worlda#39;s largest supplier of NAND Flash, Samsung, has different point of view for the adoption of 3D IC technology on ... In addition, since the system required for more memory capacity, the demand for larger capacity DRAM product is also anbsp;...

Title:3D Integration for VLSI Systems
Author:Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Publisher:CRC Press - 2011-09-26


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